汪正平（香港中文大学）

   Biography：

Prof. C. P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no pay long leave from the Georgia Institute of Technology(GT) where he is a Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering. He received his B.S. degree from Purdue University, and his MS. and Ph.D. degrees from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992 for his seminal contributions to low-cost high-performance packaging of semiconductor devices and components.

     The advance of semiconductor technology is mainly due to the advances of materials, especially polymeric materials. These include the use of polymers as:  adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics (low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level packages for device protection), embedded passives (high K capacitors, high Q inductors for high density PWB substrates), superhydrophobic self-cleaning lotus effect surfaces, etc. In this presentation, I will review some of the recent advances on polymeric materials and polymer nanocomposites that are currently being investigated for these types of applications, such as : lead-free flexible electrically conductive adhesives (ECAs) with flexible/stretchable properties, self assembly monolayer molecular wires for fine pitch and high current density interconnects, flip chip and wafer level underfills, nano lead-free alloys for low temperature interconnects, well-aligned carbon nanotubes and graphenes for high current and high thermal interface materials(TIMs), and superhydrophobic self-clean lotus surface coatings for MEMS and high efficiency solar cell applications.